Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-11-27
1989-08-15
Ivy, C. Warren
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156327, 156330, 156333, 156334, 523400, 523427, 523176, 525109, 525111, 525112, 525125, 525126, 525438, 525440, 525445, 525455, C08F27902, C08L 6300
Patent
active
048571318
ABSTRACT:
A two-part, heat stable, peroxide-free adhesive that can be mixed in equal parts with rapid cure for the bonding of plastics and metals has been discussed. Part A of the adhesive contains a polymeric material, an olefinically unsaturated monomer, an acid material, a compound containing a sulfonyl halide group, and a compound containing a transition metal; and Part B contains a polymeric material (preferably a phenoxy resin) and monomer of the same class and a Zn, Cu or Cd metal powder.
REFERENCES:
patent: 4703089 (1987-10-01), Damico
Bennett Ruth M.
Damico Dennis J.
Mushrush Kenneth W.
Ivy C. Warren
Lord Corporation
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