Two-pack type adhesive

Details Two-pack type adhesive Two-pack type adhesive

2003-02-14

2009-02-17

Zimmer, Marc S (Department: 1796)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S330000, C428S413000, C428S414000, C525S523000, C528S092000

Reexamination Certificate

active

07491290

ABSTRACT:
Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials separately containing first and second curing agents, respectively. It is only after reaction of the first and second curing agents that the first and second resin components are polymerized. As long as the two adhesive materials are isolated from each other, the adhesive is not cured. In case a metal chelate or a metal alcoholate is used as the first curing agent and a silane coupling agent is used as the second curing agent, cations as a curing component are isolated to cause cationinc polymerization of the first and second resin components to allow for curing at a lower temperature in a shorter time than in case a conventional adhesive is used.

REFERENCES:
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patent: 4954354 (1990-09-01), Hopkins
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patent: 2000-230091 (2000-08-01), None
patent: 2001-002893 (2001-01-01), None
patent: 2001-303013 (2001-10-01), None
Patent Abstracts of Japan for JP Publication No. 09-255759 dated Sep. 30, 1997 (1 page).
Patent Abstracts of Japan for JP Publication No. 2001-002893 dated Jan. 9, 2001 (1 page).
Japanese Office Action dated Mar. 18, 2008, issued in JP Patent Application No. 2002-044240 (5 pages).
Decision to Grant Japanese Patent, issued in JP Patent Application No. 2002-044240 dated Jul. 22, 2008 (English Translation attached) (6 pages).

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