Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Making emissive array
Patent
1991-10-07
1994-02-22
Robinson, Ellis P.
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Making emissive array
428 368, 4285428, 428 367, 215 1C, 215 121, B65D 2300, B32B 108
Patent
active
RE0345520
ABSTRACT:
A plastic preform from which a plastic container is blow molded. The preform replaces a three layer preform by providing a preform which is of a five layer construction in the base forming portion thereof and wherein a secondary material which forms the core layer of the three layer preform construction is divided into an inner intermediate layer and an outer intermediate layer by a third injection of material. The third injected material is preferably the same material as the primary material which is first injected. This results in the reduction of the cost of the preform and also provides remaining in the injection nozzle a quantity of the last injected material which is the same as the first injected material for the following preform in the same preform injection mold cavity.
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patent: 4550043 (1985-10-01), Beck
patent: 4609516 (1986-09-01), Krishnakumar
patent: 4725464 (1988-02-01), Collette
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R. J. McDonald and T. W. Nash, "Electric Shielding for Foam-Molded Applications," IBM Technical Disclosure Bulletin, vol. 19, No. 11, Apr. 1977.
Collette Wayne N.
Krishnakumar Suppayan M.
Nahill Thomas E.
Schmidt Steven L.
Continental PET Technologies Inc.
Nold Charles R.
Robinson Ellis P.
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