Two-layer structure molded by using thermoplastic resin

Details Two-layer structure molded by using thermoplastic resin Two-layer structure molded by using thermoplastic resin

1984-12-17

1986-04-29

Thibodeau, Paul J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

252500, 428323, 428328, 428329, B32B 330, B32B 2706

Patent

active

045856869

ABSTRACT:
A two-layer structure molded by using thermoplastic resin is provided in the instant invention. Said two-layer structure comprises one layer (a) of thermoplastic resin in which no electroconductive filler is mixed, and the other layer (b) of thermoplastic resin in which electroconductive filler is mixed wherein one or more projections which penetrate said layer (b) are formed on said layer (a).

REFERENCES:
patent: 4137361 (1979-01-01), Deffeyes
patent: 4218507 (1980-08-01), Deffeyes et al.
patent: 4447492 (1984-05-01), McKaveney

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