Two-layer or multilayer printed circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174259, 174261, 361778, H05K 100

Patent

active

054039789

ABSTRACT:
A two-layer or multilayer printed circuit board (1) comprises a support plate (2) carrying a first conductor pattern (3) and a second conductor pattern (21) which is connected to the support plate (2) via an adhesive layer (13) consisting of adhesive material, a solder-stop layer (30) being applied to the second conductor pattern. A hole (14, 15) is formed in the adhesive layer (13), via which hole a solder section (4, 5) of the first conductor pattern (3) can be electrically connected to a solder section (22, 23) of the second conductor pattern (21) via a soldered joint (37, 38), a further hole (31, 32) being formed in the solder-stop layer (30), which hole communicates with the hole (14, 15) in the adhesive layer (13), the cross-sectional area of the further hole being divisible in two areas of equal shape and equal surface content, one of the areas being coincident with the cross-sectional area of the hole (14, 15) in the adhesive layer (13) and the other area being situated completely inside a closed area of the solder section (22, 23) of the second conductor pattern (21).

REFERENCES:
patent: 4024629 (1977-05-01), Lemoine et al.
patent: 4088828 (1978-05-01), Yamamoto et al.
patent: 4963697 (1990-10-01), Peterson et al.
patent: 5072075 (1991-12-01), Lee et al.

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