Two layer hermetic-like coating process for on-wafer encapsulati

Details Two layer hermetic-like coating process for on-wafer encapsulati Two layer hermetic-like coating process for on-wafer encapsulati

1997-05-27

1999-06-22

Turner, A. A.

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Junction field effect transistor

428210, 428500, 428698, 428195, 257 7, 257272, 257277, 257723, 257787, 257788, 330307, 354205, H01L 2170, H01L 2702

Patent

active

059145080

ABSTRACT:
A microwave system encapsulated by two layers. The first layer is an arylcyclobutene polymer having a thickness greater than the tallest component of the system and only located in predetermined areas. Overlaying the polymer and other preselected areas of the system is a ceramic glass material. These two layers are applied in two layers coating process steps.

REFERENCES:
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4737236 (1988-04-01), Perko et al.
patent: 4780177 (1988-10-01), Wojnarowski et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 5154793 (1992-10-01), Wojnarowski et al.
patent: 5461545 (1995-10-01), Leroy
patent: 5497033 (1996-03-01), Fillion
Kaleta, et al., GaAs IC Symposium, IEEE Gallium Arsenide Integrated Circuit Symposium 17th Ann. Tech. Dig. 1995. Oct. 29 to Nov. 1, 1995 (abstract only).
Concise Chemical & Technical Dictionary Edited by H. Bennett, pp. 573, 279.
Case et al., High Performance Microwave Elements for SiGe MMICs, Proc. IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits Aug. 7-9, 1995, pp. 85-92.
M.sup.4 CMs for Microwave Applications, Feurer et al., ISHM '94 Proceed.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology; "Processing and Microwave Characterization of Multilevel Interconnects Using Benzocyclobutene Dielectric"; Chinoy et al.; vol. 16, No. 7, Nov. 1993.
International Conference on Multichip Modules; "Processing and Electrical Characterization of Multilayer Metallization For Microwave Applications"; Percy B. Chinoy; Apr. 1995.
M/A-COM Loud & Clear; "Balun" Transformers for RF Chip Sets, Mixers and Broadband Impedance Matching; Simon Gay; Feb. 1995.
IEEE Publication (Publication Title Unknown), "A Photosensitive-BCB on Laminate Technology (MCM-LD)", Publication Date Jan. 5, 1994, pp., 374-386 .

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