Two-layer copper polyimide substrate

Details Two-layer copper polyimide substrate Two-layer copper polyimide substrate

2005-04-05

2005-04-05

Seidleck, James J. (Department: 1711)

Stock material or miscellaneous articles

Composite

Of polyimide

C205S095000, C205S187000

Reexamination Certificate

active

06875519

ABSTRACT:
A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 Å, and preferably not less than 50 Å, as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous solution and observing it by a transmission electron microscope (TEM). A metal seed layer is formed on the polyimide film surface, followed by forming a copper layer thereon by copper electroplating or copper electroless plating or a combination of the both, providing a two-layer copper polyimide substrate in which any of an initial adhesion, a heat resistant adhesion after standing in air at 150° C. for 168 hours, and a PCT adhesion after PCT test at 121° C. and at a humidity of 95% under 2 atmospheres for 100 hours are 400 N/m or more.

REFERENCES:
patent: 5667851 (1997-09-01), Edman et al.
patent: 6042929 (2000-03-01), Burke et al.
patent: 6045713 (2000-04-01), Tamiya et al.

Affiliated with

Also associated with

Rating

Two-layer copper polyimide substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Two-layer copper polyimide substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Two-layer copper polyimide substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3376440