Two-dimensional patterning method, electronic device using...

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C250S492210, C250S492220, C250S492300, C250S492100

Reexamination Certificate

active

07495238

ABSTRACT:
A novel two-dimensional patterning method enabling two-dimension patterning without using any photosensitive material and ion milling, wherein a two-dimensional pattern is formed by destroying a blister provided on a substrate by electron or ion irradiation.

REFERENCES:
patent: 4843238 (1989-06-01), Nishioka et al.
patent: 5660957 (1997-08-01), Chou et al.
patent: 6197697 (2001-03-01), Simpson et al.
patent: 6225193 (2001-05-01), Simpson et al.
patent: 6407399 (2002-06-01), Livesay
patent: 7038290 (2006-05-01), Li

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Two-dimensional patterning method, electronic device using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Two-dimensional patterning method, electronic device using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Two-dimensional patterning method, electronic device using... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4094930

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.