Two-component adhesive for producing semi-finished products...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C523S428000, C525S528000

Reexamination Certificate

active

08062467

ABSTRACT:
Two-component adhesives (K), which includes two components K1and K2. Component K1includes at least one epoxy resin A with more than one epoxy group per molecule on average; at least one epoxy adduct B with more than one epoxy group per molecule on average that is an epoxy adduct of type B1and optionally combined with an epoxy adduct of type B2; at least one reaction product F between an epoxy adduct B and a compound C, which has at least two isocyanate groups, in addition to at least one curing agent D for epoxy resins, which is activated by increased temperature. The component K2comprises a compound E, which includes at least two isocyanate groups.

REFERENCES:
patent: 4578424 (1986-03-01), Goel
patent: 4728737 (1988-03-01), Goel
patent: 4962138 (1990-10-01), Kimball
patent: 5079094 (1992-01-01), Kimball
patent: H2047 (2002-09-01), Harrison et al.
patent: 2005/0159511 (2005-07-01), Kramer
patent: 199 19 783 (2000-11-01), None
patent: 0 343 676 (2003-11-01), None
patent: 1 359 202 (2003-11-01), None
patent: WO 00/21747 (2000-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Two-component adhesive for producing semi-finished products... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Two-component adhesive for producing semi-finished products..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Two-component adhesive for producing semi-finished products... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4291028

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.