Twin-substrate wireless electronic module and method for...

Details Twin-substrate wireless electronic module and method for... Twin-substrate wireless electronic module and method for...

2007-06-19

2007-06-19

Le, Thao X. (Department: 2809)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S752000, C361S767000, C361S749000, C361S600000

Reexamination Certificate

active

11375046

ABSTRACT:
A twin-substrate wireless electronic module includes a main substrate, a plurality of integrated circuit chips, a frame substrate, a filter, and a shield member. The main substrate has a first surface and a second surface, and is formed with a notch that extends from the first surface through the second surface. The integrated circuit chips are surface-mounted on the first and second surfaces of the main substrate. One of the integrated circuit chips disposed on the first surface is a transceiver integrated circuit chip. The frame substrate has a first frame surface and a second frame surface. The first frame surface has a filter-mounting area aligned with the notch. The filter is surface-mounted on the filter-mounting area and is accommodated in the notch. A method for manufacturing the twin-substrate wireless electronic module is also disclosed.

REFERENCES:
patent: 5481436 (1996-01-01), Werther
patent: 5747875 (1998-05-01), Oshima

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