Tweezers for removal of dual in-line pin (DIP) components

Tools – Shingle tool

Patent

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Details

128354, 29278, 29764, 29739, B25B 902, B25B 2714

Patent

active

043899129

ABSTRACT:
A pair of tweezers specifically designed for removing DIP (dual in-line pins) components or other electronic components from a circuit board. To this end, the tweezers include a pair of legs secured together at the top portion and having a sharply inwardly bent end portion formed with claws for engaging the pins of a DIP component. Near the curved ends of the tweezers there may be provided a bumper for each leg extending through an opening in the leg. The bumper serves the purpose to hold the DIP component between the curved end portions and the bumpers. A sliding clamp is provided which is of general U-shape and provided with an elongated slit. The clamp may be secured by a knurled nut extending through an opening in the legs of the tweezers. Hence, the clamp may be slid downwardly of the legs to squeeze them together. Thus, the opening between the jaws may be adjusted to the size of the component to be removed. A spring-biased pin may alternatively be secured to the lower portions of the legs to assist in withdrawing the DIP component. Finally, the jaws may be made exchangable by simply removing the lower portions of the tweezers. They may be removably secured together by an interlocking construction of the two end portions of the legs.

REFERENCES:
patent: 789539 (1905-05-01), Harris
patent: 1284060 (1918-11-01), Culman
patent: 1758490 (1930-05-01), Aderer
patent: 2376135 (1945-05-01), Frasher
patent: 3007244 (1961-11-01), De Vern Austin
patent: 3253327 (1966-05-01), McElligatt
patent: 3916909 (1975-11-01), Kletschka et al.

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