Handling: hand and hoist-line implements – Grapple – Resilient jaws
Patent
1990-11-15
1992-11-17
Focarino, Margaret A.
Handling: hand and hoist-line implements
Grapple
Resilient jaws
294 2, 2941031, 29740, B66C 142, B23P 2100
Patent
active
051637286
ABSTRACT:
A method and apparatus for attaching semiconductor dice to substrates includes a novel die-grasping apparatus and technique which employs a tweezer-like clamping device which has one fixed leg. The second leg of the clamping device is movable laterally towards the fixed leg by means of a linear actuator coupled to the movable leg through a spring. Lateral spacing between the linear actuator and the movable leg is adjustable, allowing the spring to be prestressed to a precisely adjustable value, thereby resulting in a precisely pre-adjustable side-gripping force on the lateral sides of a semiconductor chip or die, ensuring that the fragile die will not be broken by the grasping action. The preferred embodiment employs a micro-manipulator to precisely position a die in place on a molten solder pre-form on a substrate, and a vacuum probe for first placing the pre-form on the substrate. Also included in the preferred embodiment is a load cell responsive to a pre-determined normal force on a die in initiating lateral oscillation of the die in contact with the liquified pre-form. This "scrubbing" action improving the quality of the bond formed between the die and substrate when the solder re-solidifies.
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patent: 4872803 (1989-10-01), Asakawa
Biggs Kenneth L.
Miller Charles F.
Chapin William L.
Focarino Margaret A.
Kramer Dean J.
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