Turning tool for grooving polishing pad, apparatus and...

Metal working – Plural diverse manufacturing apparatus including means for... – Multiple-tool holder

Reexamination Certificate

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Details

C407S067000, C407S069000, C407S070000, C407S117000, C407S113000

Reexamination Certificate

active

07017246

ABSTRACT:
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005–1.0 mm, a wedge angle within a range of 15–35 degrees, and a front clearance angle within a range of 65–45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.

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The Science of CMP; Aug. 20, 1997; pp. 113-119; Chapter 4, Part III “Structure and Feature of the polishing pad”.

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