Abrading – Abrading process
Reexamination Certificate
2006-09-12
2006-09-12
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
C451S319000, C451S324000, C083S875000
Reexamination Certificate
active
07104868
ABSTRACT:
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005–1.0 mm, a wedge angle within a range of 15–35 degrees, and a front clearance angle within a range of 65–45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.
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The Science of CMP; Aug. 20, 1997; pp. 113-119; Chapter 4, Part III “Structures and Feature of th polishing pad”.
Morgan Eileen P.
Rossi Kimms & McDowell LLP
Toho Engineering Kabushiki Kaisha
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