Turning tool for grooving polishing pad, apparatus and...

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S246000, C451S249000, C083S875000

Reexamination Certificate

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06869343

ABSTRACT:
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.

REFERENCES:
patent: 5398458 (1995-03-01), Henriksen et al.
patent: 5921855 (1999-07-01), Osterheld et al.
patent: 5984769 (1999-11-01), Bennett et al.
patent: 6238271 (2001-05-01), Cesna
patent: 6241585 (2001-06-01), White
patent: 6561891 (2003-05-01), Eppert, Jr. et al.
patent: 6572445 (2003-06-01), Laursen
patent: 6602436 (2003-08-01), Mandigo et al.
patent: 6641471 (2003-11-01), Pinheiro et al.
patent: 47-16044 (1972-06-01), None
patent: 63-22002 (1988-06-01), None
patent: 11-70463 (1999-03-01), None
patent: 2000-94303 (2000-04-01), None
The Science fo CMP; Aug. 20, 1997; pp. 113-119; Chapter 4, Part III “Structure and Feature of the polishing pad”.

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