Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2011-05-17
2011-05-17
Rashid, David P (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C438S586000
Reexamination Certificate
active
07945086
ABSTRACT:
A first embodiment of the invention relates to a method for evaluating the quality of structures on an integrated circuit wafer. Test structures formed on either on the integrated or on a test wafer are exposed to an electron beam and an electron-beam activated chemical etch. The electron-beam activated etching gas or vapor etches the test structures, which are analyzed after etching to determine a measure of quality of the test structures. The measure of quality may be used in a statistical process control to adjust the parameters used to form device structures on the integrated circuit wafer. The test structures are formed on an integrated circuit wafer having two or more die. Each die has one or more integrated circuit structures. The test structures are formed on scribe lines between two or more adjacent die. Each test structure may correspond in dimensions and/or composition to one or more of the integrated circuit structures.
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Gotkis Yehiel
Lopatin Sergey
Nasser-Ghodsi Mehran
Isenberg Joshua D.
JDI Patent
KLA-Tencor Technologies Corporation
Rashid David P
LandOfFree
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