Tungsten metallization of CVD diamond

Details Tungsten metallization of CVD diamond Tungsten metallization of CVD diamond

1993-08-02

1994-09-13

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4272481, 427250, 427380, 4273831, 427399, 29846, 29852, B05D 512

Patent

active

053467191

ABSTRACT:
A process for significantly improving the adhesion of a refractory metal deposited on diamond is disclosed. The process involves depositing an initial thin metal coating by low pressure chemical vapor deposition on diamond, heat treating in a non-oxidizing environment, and continuing the deposition of the initial metal coating until a desired thickness is achieved. Diamond sheets that have undergone the inventive process where 15 micrometers of tungsten are deposited, exhibit tungsten adhesive values in excess of 10,000 pounds per square inch.

REFERENCES:
patent: 3650714 (1972-03-01), Farkas
patent: 3929432 (1975-12-01), Caveney
patent: 4738689 (1988-04-01), Gigl et al.
patent: 5024680 (1991-06-01), Chen et al.
patent: 5239746 (1993-08-01), Goldman
Article-High Temperature Reliability of Refractory Metal Ohmic Contacts to Diamond, M. Roser et al, Electrochemical Society., vol. 139, No. 7, Jul. 1992-pp. 2001-2003.
Article-Applicability of Diamond Substrates to Multi-Chip Modules, Richard C. Eden, ISHM '91 Proceedings, pp. 363-367.

Affiliated with

Also associated with

Rating

Tungsten metallization of CVD diamond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tungsten metallization of CVD diamond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tungsten metallization of CVD diamond will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1118981