Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Including passive device
Reexamination Certificate
2006-09-01
2008-10-21
Lebentritt, Michael S. (Department: 2829)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Including passive device
C438S383000, C257S362000, C257S546000
Reexamination Certificate
active
07439145
ABSTRACT:
A diode structure fabrication method. In a P− substrate, an N+ layer is implanted. The N+ layer has an opening whose size affects the breakdown voltage of the diode structure. Upon the N+ layer, an N− layer is formed. Then, a P+ region is formed to serve as an anode of the diode structure. An N+ region can be formed on the surface of the substrate to serve as a cathode of the diode structure. By changing the size of the opening in the N+ layer during fabrication, the breakdown voltage of the diode structure can be changed (tuned) to a desired value.
REFERENCES:
patent: 5223737 (1993-06-01), Canclini
patent: 5426320 (1995-06-01), Zambrano
patent: 5708289 (1998-01-01), Blanchard
patent: 6507080 (2003-01-01), Jang et al.
patent: 2003/0047750 (2003-03-01), Russ et al.
Canale Anthony J.
International Business Machines - Corporation
Lebentritt Michael S.
Schmeiser Olsen & Watts
Tillie Chakila
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