Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling
Patent
1997-06-16
1999-10-26
Pascal, Robert
Amplifiers
With semiconductor amplifying device
Including distributed parameter-type coupling
330295, 330277, H03F 360
Patent
active
059735678
ABSTRACT:
The output impedance matching network of a power amplifier module is improved by the addition of an intermediate set of bonding pads in close proximity to a power transistor in the power amplifier module. A tunable set of bond wires extend from the intermediate bonding pads to a transmission line that is coupled to the output of the power amplifier module. The tunable bond wires allow the inductance of the impedance matching network to be tuned and optimized.
REFERENCES:
patent: 5162755 (1992-11-01), Mara, Jr. et al.
patent: 5357212 (1994-10-01), Kohno
patent: 5576661 (1996-11-01), Kumagai
Berman Arnold L.
Grebliunas John R.
Heal Mark D.
Ozaki Howard T.
Grunebach Georgann S.
Hughes Electronics Corporation
Nguyen Khanh Van
Pascal Robert
Sales M. W.
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