Tunable impedance matching network for a mic power amplifier mod

Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling

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330295, 330277, H03F 360

Patent

active

059735678

ABSTRACT:
The output impedance matching network of a power amplifier module is improved by the addition of an intermediate set of bonding pads in close proximity to a power transistor in the power amplifier module. A tunable set of bond wires extend from the intermediate bonding pads to a transmission line that is coupled to the output of the power amplifier module. The tunable bond wires allow the inductance of the impedance matching network to be tuned and optimized.

REFERENCES:
patent: 5162755 (1992-11-01), Mara, Jr. et al.
patent: 5357212 (1994-10-01), Kohno
patent: 5576661 (1996-11-01), Kumagai

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