Tubular pin fin heat sink for electronic components

Details Tubular pin fin heat sink for electronic components Tubular pin fin heat sink for electronic components

1993-01-21

1994-10-04

Rivell, John

Heat exchange

With retainer for removable article

Electrical component

165185, 29890044, 174 163, 361690, 361703, F28F 700

Patent

active

053517482

ABSTRACT:
A heat sink is provided, comprising a base with an array of tubular pins extending outwardly therefrom. The pins are engaged within apertures recessed into the base by means of an expansion member positioned within the tubular portion of each pin, wherein the expansion member causes the wall of the pin to deform outwardly to clampingly engage the pin within the aperture.

REFERENCES:
patent: 1900099 (1933-03-01), Ferguson
patent: 4204312 (1980-05-01), Tooker
patent: 4291364 (1981-09-01), Andros et al.
patent: 4546405 (1985-10-01), Hultmark et al.
patent: 4570317 (1986-02-01), Veling et al.
patent: 4733453 (1988-03-01), Jacoby
patent: 4761866 (1988-08-01), Murphy
patent: 5097590 (1992-03-01), Tokura
patent: 5158136 (1992-10-01), Azar
Redmond, R. J., High Thermal-Transfer Module, IBM Technical Disclosure Bulletin, vol. 24, No. 3 pp. 1668-1669, Aug. 1981.

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