Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate
2011-05-24
2011-05-24
Carrillo, Sharidan (Department: 1711)
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
C134S002000, C134S025400, C134S026000, C134S028000, C134S030000, C134S034000, C134S035000, C134S036000, C134S041000, C134S042000, C510S175000, C510S436000, C510S467000, C510S469000, C510S499000
Reexamination Certificate
active
07947130
ABSTRACT:
Semiconductor processing compositions for use with silicon wafers having an insulating layers and metallization layers on the wafers comprising water and one or more Troika acids which is also referred to as α,α-disubstituted trifunctional oximes or α-(Hydroxyimino) Phosphonoacetic acids, their salts, and their derivatives.
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