Trimming of embedded structures

Details Trimming of embedded structures Trimming of embedded structures

2005-07-26

2005-07-26

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C361S761000, C029S846000, C029S852000

Reexamination Certificate

active

06921868

ABSTRACT:
A cavity is formed in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates, such as printed circuit boards, modules, and sub-systems. Trimming is done through the cavity using, for example, a laser. After trimming the cavity is easy to fill in with a suitable dielectric material or to cover otherwise, e.g. by using a lid, or to leave the cavity uncovered.

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Abstract of JP 6165465 A, Toshiba Corp., Apr. 4, 1986.

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