Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-02-27
2007-02-27
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C361S104000, C438S132000
Reexamination Certificate
active
09970074
ABSTRACT:
A wafer containing integrated circuits having fuses which are selectively blown to trim circuit perimeters. The fuses are located adjacent scribe lanes, and fuse pads are located in the scribe lanes. The integrated circuits are trimmed by selectively energizing the fuse pads to blow selective fuses. When the integrated circuits are severed from the wafer, the fuse pads are severed from the integrated circuits.
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Jensen William D.
Kelly David W.
Malka Ronen
Agere Systems Inc.
Chambliss Alonzo
Kinney & Lange PA
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