Semiconductor device manufacturing: process – Making conductivity modulation device
Reexamination Certificate
2005-12-28
2009-06-09
Tran, Long K (Department: 2818)
Semiconductor device manufacturing: process
Making conductivity modulation device
C438S197000, C438S212000, C438S268000, C438S270000, C438S272000, C257SE21355, C257SE21356, C257SE21357, C257SE21358
Reexamination Certificate
active
07544545
ABSTRACT:
Embodiments of the present invention include a method of manufacturing a trench polysilicon diode. The method includes forming a N−(P−) type epitaxial region on a N+(P+) type substrate and forming a trench in the N−(P−) type epitaxial region. The method further includes forming a insulating layer in the trench and filling the trench with polysilicon forming a top surface of the trench. The method further includes forming P+(N+) type doped polysilicon region and N+(P+) type doped polysilicon region in the trench and forming a diode in the trench wherein a portion of the diode is lower than the top surface of the trench.
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Chen Qufei
Pattanayak Deva
Terrill Kyle
Xu Robert
Tran Long K
Vishay-Siliconix
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