Trench isolation structure and method of manufacture therefor

Details Trench isolation structure and method of manufacture therefor Trench isolation structure and method of manufacture therefor

2007-10-09

2007-10-09

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Grooved and refilled with deposited dielectric material

C438S425000, C438S427000, C438S435000, C438S296000, C438S221000, C438S400000, C438S248000, C257SE21549

Reexamination Certificate

active

10953632

ABSTRACT:
The present invention provides a trench isolation structure, a method for manufacturing a trench isolation structure, and a method for manufacturing an integrated circuit including the trench isolation structure. In one aspect, the method includes forming a hardmask over a substrate, etching a trench in the substrate through the hardmask, forming a liner in the trench, depositing an interfacial layer over the liner within the trench and over the hardmask and filling the trench with a dielectric material.

REFERENCES:
patent: 5436488 (1995-07-01), Poon et al.
patent: 6486039 (2002-11-01), Yoo et al.
patent: 6576530 (2003-06-01), Chen et al.
patent: 2002/0137279 (2002-09-01), Park et al.
patent: 2002/0142622 (2002-10-01), Iijima et al.
patent: 2004/0251511 (2004-12-01), Desko et al.
patent: 2005/0167778 (2005-08-01), Kim et al.
patent: 2005/0266655 (2005-12-01), Nemani et al.
patent: 2005/0282353 (2005-12-01), Wise et al.

Affiliated with

Also associated with

Rating

Trench isolation structure and method of manufacture therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Trench isolation structure and method of manufacture therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Trench isolation structure and method of manufacture therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3832298