Trench isolation structure and method of forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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C257SE21545, C257SE21572, C257SE21550, C257SE21564

Reexamination Certificate

active

07154159

ABSTRACT:
A trench isolation structure and a method of forming a trench isolation structure are provided. The method includes providing a substrate having a trench. A polysilicon liner is formed in the trench. A dielectric layer, such as spin-on glass, is formed in the trench upon the polysilicon liner.

REFERENCES:
patent: 6844591 (2005-01-01), Tran
patent: 2004/0180510 (2004-09-01), Ranade et al.

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