Trench isolation for semiconductor device with lateral projectio

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

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257510, 257524, 257547, 257354, 257374, 257395, H01L 2900, H01L 2362, H01L 2976

Patent

active

060206225

ABSTRACT:
A semiconductor device includes a semiconductor substrate in which a trench for element isolation is formed, and an element isolation oxide film buried into the trench in such a manner that the element isolation oxide film is projected from the surface of the semiconductor substrate. The element isolation oxide film which is an element isolation insulating film for defining an element forming region on the semiconductor substrate has a projection portion above the surface of the semiconductor substrate. The projection portion has the width wider than that of the trench. The projection portion and a contact portion made in contact with the semiconductor substrate within the trench are made of thermal oxide films, and a portion other than the projection portion and the contact portion is made of a CVD dioxide film.

REFERENCES:
patent: 4903095 (1990-02-01), Chapron
patent: 5646052 (1997-07-01), Lee

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