Trench cut light emitting diodes and methods of fabricating...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing

Reexamination Certificate

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C438S637000

Reexamination Certificate

active

06995032

ABSTRACT:
A method is provided for forming semiconductor devices using a semiconductor substrate having first and second opposed sides, and at least one device layer on the second side of the substrate, the at least one device layer including first and second device portions. A first trench is formed in the first side of the substrate between the first and second device portions. A second trench is formed in the second side of the substrate between the first and second device portions.

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International Search Report for PCT/US03/22411, Jun. 7, 2004.

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