Treatment to reduce solder plating whisker formation

Details Treatment to reduce solder plating whisker formation Treatment to reduce solder plating whisker formation

1989-08-10

1994-06-14

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming nonelectrolytic coating before depositing...

205215, 205254, C25D 534

Patent

active

053207378

ABSTRACT:
The formation of whiskers during tin or tin-lead solder electroplating of a copper base alloy substrate in a methane sulfonate solder plating bath is inhibited by passivating the surface of the substrate prior to electroplating. Preferred passivating solutions include an aqueous solution of sodium dichromate and phosphoric acid, and an aqueous solution of chromic acid and phosphoric acid. Passivation is preferably followed by treatment with a basic solution having a pH of at least 8.

REFERENCES:
patent: 3518168 (1970-06-01), Byler
patent: 4589962 (1986-05-01), Sajja et al.
patent: 4599149 (1986-07-01), Nobel et al.
patent: 4662999 (1987-05-01), Opaskar et al.
patent: 4749626 (1988-06-01), Kadija et al.
H. Silman et al., Protective and Decorative Coatings for Metals, Finishing Publications, Ltd., Teddington, Middlesex, England, 1978, pp. 123-132, 147-151.
Metal Finishing Guidebook and Directory for 1975, Metals and Plastics Publications, Inc., Hackensack, N.J., pp. 146-147.

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