Chemistry: electrical and wave energy – Processes and products
Patent
1982-06-01
1984-03-27
Williams, Howard S.
Chemistry: electrical and wave energy
Processes and products
148 614R, 148 627, 427436, 156150, 204 33, 204181R, C25D 500, C25D 544, C23F 706
Patent
active
044392826
ABSTRACT:
A process for enhancing adhesive bonding of a metal substrate, particularly aluminum, which comprises treating the aluminum substrate, after optional cleaning thereof in an alkaline solution, with an ammoniacal solution of a copper salt, e.g. copper sulfate, to form a cuprammonium, i.e. [Cu(NH.sub.3).sub.4 ]SO.sub.4, solution containing the complex Cu(NH.sub.3).sub.4.sup.++ ion. Such treatment provides a controlled etch of the aluminum substrate and increases the surface area thereof, resulting in enhanced reactivity of each surface with an adhesive during adhesive bonding, and providing a strong adhesive bond between the adhesive coating and the metal substrate. When such cuprammonium treatment of an aluminum surface is followed by electrodeposition of an organic coating, as described in U.S. Pat. No. 4,180,442, prior to application of an adhesive coating, a strong adhesive bond having consistently high lap shear values is obtained.
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Chapman Terryence
Geldin Max
McDonnell Douglas Corporation
Williams Howard S.
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