Treatment of copper foil

Details Treatment of copper foil Treatment of copper foil

1983-12-01

1984-09-04

Tufariello, Thomas

Chemistry: electrical and wave energy

Processes and products

204 40, C25D 510, C25D 706, C25D 1138

Patent

active

044695675

ABSTRACT:
A method of treating copper foil for use in the production of printed circuit boards to improve the adhesion of the foil to a base material includes the steps of depositing a nodular or dendritic layer of metal such as copper or zinc onto the foil and encapsulating said nodular or dendritic layer of metal with a layer of copper. A barrier layer is deposited over said encapsulating layer of copper, the barrier layer comprising an alloy of zinc, nickel and one or more of the metals lead, selenium, tellurium, tin or arsenic, the resultant structure then being passivated.

REFERENCES:
patent: 3857681 (1974-12-01), Yates
patent: 4282073 (1981-08-01), Hirt

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