Treatment of copper and use thereof

Details Treatment of copper and use thereof Treatment of copper and use thereof

1980-12-01

1982-11-09

Powell, William A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156630, 156656, 156666, 156902, 427322, B05D 512, C23F 100

Patent

active

043584799

ABSTRACT:
A method for modifying the surface characteristics of copper foil by contacting a surface thereof with an oxidizing composition; and use of the treated copper foil in the preparation of printed circuits.

REFERENCES:
patent: Re28042 (1974-06-01), Rhodenizer et al.
patent: 2932599 (1960-04-01), Dahlgren
patent: 3672986 (1972-06-01), Schneble et al.
patent: 3846168 (1974-11-01), Elmore
patent: 3854973 (1974-12-01), Mersereau et al.
patent: 4110147 (1978-08-01), Grunwald et al.
patent: 4127438 (1980-11-01), Babcock et al.
patent: 4144118 (1979-03-01), Stahl
patent: 4188240 (1980-02-01), Yoshio
patent: 4203809 (1980-05-01), McKean
patent: 4216246 (1980-08-01), Iwasaki et al.
Transactions of the Institute of Metal Finishing, 1968, vol. 46, pp. 91-94, The Adhesion of Electroless Metal Deposits to A B S and Other Polymers by Logi et al.
Journal of the Electrochemical Society, Electrochemical Technology, Oct. 1969, pp. 1455-1458, Mechanism of Bonding Electroless Metal to Organic Substrates by Elmore et al.
Metal Finishing, Nov. 1968, pp. 80-84, Adhesion of Electrodeposits to Plastics-An Electron Microscopic Investigation by Matsunaga et al.

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