Treatment of a substrate surface to reduce solder sticking

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29825, 174 685, 228215, 427 96, H05K 302

Patent

active

043897711

ABSTRACT:
A method for preventing solder sticking on printed circuit substrates comprises mechanically roughening the surface of the substrate.

REFERENCES:
patent: 1899068 (1933-02-01), Walsh et al.
patent: 2421079 (1947-05-01), Narcus
patent: 2599710 (1952-06-01), Hathaway
patent: 3339008 (1967-08-01), MacArthur et al.
patent: 3343976 (1967-09-01), Matlock
patent: 3546009 (1970-12-01), Schneble, Jr. et al.
patent: 3610811 (1971-10-01), O'Keefe
patent: 3851223 (1974-11-01), Yonezuka et al.
patent: 3915809 (1975-10-01), Wheatley
"Printed Circuit Techniques" by R. J. Ryan in RCA Technical Notes, No. 768, Apr., 1968.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Treatment of a substrate surface to reduce solder sticking does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Treatment of a substrate surface to reduce solder sticking, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Treatment of a substrate surface to reduce solder sticking will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-926942

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.