Treatment method of semiconductor wafers and the like and treatm

Details Treatment method of semiconductor wafers and the like and treatm Treatment method of semiconductor wafers and the like and treatm

1997-12-08

1999-09-14

Warden, Jill

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 21, 134 952, 134902, 134 30, 134 31, 134 32, B08B 504, B08B 300, B08B 500, B08B 102

Patent

active

059517794

ABSTRACT:
A treatment method of semiconductor wafers and the like, for carrying out step by step in a sealed container, a series of processes comprising chemical process with a cleaning chemical (chemical process) and final water rinsing process by using rinsing pure water (rinse process) and a drying process of removing attached water from the surface of an object through mixing substitution using an organic solvent, and a treatment system for the same, wherein warm pure water is fed into the sealed container after the final water rinsing process of the cleaning process is completed. The vapor or fog of the organic solvent is fed into the space procured on the upper side of the container upward the water surface of pure warm water, where the object as placed vertically in parallel arrangement is immersed and sunk. After the upper space is filled with the organic solvent, inert gas is fed into the container, while the warm pure water is discharged under aspiration from the bottom side of the container at a state such that the feeding of the organic solvent is stopped.

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