Treatment for copper foil

Details Treatment for copper foil Treatment for copper foil

1985-06-28

1986-02-25

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

156151, 204 27, 204 40, 204 442, 428626, 428637, 428658, 428675, 428686, C25D 510, C25D 706

Patent

active

045727686

ABSTRACT:
An improved treatment for copper foil that is to be used for lamination to a board comprises electrodepositing a dendritic layer of copper on the side of the foil that is to be laminated to the board. The dendritic layer is secured by electrodepositing a gilding layer of copper over it. A barrier layer is next electrodeposited over the gilding layer. The barrier layer is formed by means such as electrodeposition from a solution containing ions of zinc, nickel and antimony. This in turn is covered with an anticorrosion layer that is formed of chromates or phosphates, disposed over the barrier layer.

REFERENCES:
patent: Re30180 (1979-12-01), Wolski et al.
patent: 3857681 (1974-12-01), Yates et al.
patent: 4456508 (1984-06-01), Torday et al.
patent: 4469567 (1984-09-01), Torday et al.

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