Treating laminates with a wetting/reducing solution after desmea

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427 96, 427306, 4274431, B05D 512, B05D 304, B05D 310, B05D 118

Patent

active

048731226

ABSTRACT:
An aqueous composition is provided for treating a laminate in the manufacture of a printed circuit board, the composition comprising a wetting agent, which has a positively charged quaternary nitrogen atom, and a reducing agent which is compatible with the wetting agent. Preferably the reducing agent is hydroxylamine or one or more of its salts, but oxalic acid or one or more oxalates may, alternatively or as well, be used. The compatibility of the wetting and reducing agents enables the number of process steps to be reduced.

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Hackh's Chemical Dictionary, 3rd Ed., Julius Grant, McGraw-Hill Book Co., Inc., N.Y., pp. 425-427, 1966.

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