Treating copper surfaces for electronic applications

Details Treating copper surfaces for electronic applications Treating copper surfaces for electronic applications

2005-11-08

2005-11-08

Yao, Sam Chuan (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S274800, C156S275700, C156S307700, C156S327000, C029S458000

Reexamination Certificate

active

06962642

ABSTRACT:
A process by which high frequency printed wiring board construction can be fabricated using smooth copper surfaces. A conductive, thin film polymer is plated on smooth copper surfaces of a core lamination. The polymer can be selected from a group of materials consisting of polypyrrole, polyaniline, polythiophene, and combinations thereof. The conductive polymer promotes adhesion between the resin polymer of the laminate and the smooth copper surfaces.

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