Treated copper foil and process for making treated copper foil

Details Treated copper foil and process for making treated copper foil Treated copper foil and process for making treated copper foil

1998-09-10

2000-10-17

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming multiple superposed electrolytic coatings

205178, 205184, 205186, 205187, 205191, 205192, 205220, 427331, 427406, 4274192, 4274193, 4274195, C25D 510, C25D 512, C23C 2802, B01D 140, B05D 136

Patent

active

061325899

ABSTRACT:
This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 .ANG. to about 80 .ANG.; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.

REFERENCES:
patent: 3970608 (1976-07-01), Furukawa et al.
patent: 4061837 (1977-12-01), Hutkin
patent: 4088544 (1978-05-01), Hutkin
patent: 4409037 (1983-10-01), Landan
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4642161 (1987-02-01), Akahoshi et al.
patent: 4806200 (1989-02-01), Larson et al.
patent: 4844981 (1989-07-01), Landau
patent: 5017271 (1991-05-01), Whewell et al.
patent: 5061550 (1991-10-01), Shimizu et al.
patent: 5108026 (1992-04-01), Su et al.
patent: 5135629 (1992-08-01), Sawada et al.
patent: 5252355 (1993-10-01), Ando et al.
patent: 5288377 (1994-02-01), Johnson et al.
patent: 5338619 (1994-08-01), Fukuda et al.
patent: 5382333 (1995-01-01), Ando et al.
patent: 5389446 (1995-02-01), Yaminishi et al.
patent: 5431803 (1995-07-01), DoFramco et al.
patent: 5456817 (1995-10-01), Hino et al.
patent: 5476908 (1995-12-01), Kishi et al.
patent: 5478599 (1995-12-01), Iyer et al.
patent: 5492722 (1996-02-01), Tait et al.
patent: 5552234 (1996-09-01), Kawasumi
patent: 5567534 (1996-10-01), Yano et al.
patent: 5597876 (1997-01-01), Murata et al.
patent: 5618891 (1997-04-01), Markovitz
patent: 5622782 (1997-04-01), Poutasse, III et al.
patent: 5630874 (1997-05-01), Tait et al.
patent: 5670250 (1997-09-01), Sanville, Jr. et al.
patent: 5709957 (1998-01-01), Chiang et al.
patent: 5712047 (1998-01-01), Aso et al.
patent: 5908544 (1999-06-01), Lee et al.
PCT Search Report for Application No. PCT/US99/21473 dated Jan. 13, 200.
Patent Cooperation Treaty International Search Report, Application No. PCT/US99/21473, dated Jan. 13, 2000.
Chapter 9 of Vapor Deposition, C. F. Powell, et al., J. Wiley & Sons, Inc. New York, 1966 no month available.

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