Special receptacle or package – Holder for a removable electrical component
Patent
1997-06-30
1999-07-27
Chaudhuri, Olik
Special receptacle or package
Holder for a removable electrical component
206722, 206725, 206560, 206564, 206565, 257666, 257696, 257730, B65D 134, B65D 8500, B65D 8530, B65D 8548
Patent
active
059275030
ABSTRACT:
An apparatus for processing an integrated circuit device comprises at least one insert having at least one beveled hole therein, the insert adapted to receive at least one semiconductor device. The apparatus further includes a tray having a pocket for receiving the insert and a slot, a deformable segment on the insert, and at least three posts on the insert. Further included is at least one tab on the deformable segment with one of the slots receiving the tab. The slot in the tray and the tab on the insert movably attaches the insert to the tray, the insert being self-aligning to a processing apparatus thereby in conjunction with the posts and allowing for removal of the insert from the pocket.
REFERENCES:
patent: 3454921 (1969-07-01), Coleman et al.
patent: 4000798 (1977-01-01), Cedrone
patent: 4417777 (1983-11-01), Bamford
patent: 4435724 (1984-03-01), Ralstin
patent: 4686468 (1987-08-01), Lee et al.
patent: 4798305 (1989-01-01), Laverty
patent: 4869636 (1989-09-01), Reid et al.
patent: 4926118 (1990-05-01), O'Conner et al.
patent: 4933808 (1990-06-01), Horton et al.
patent: 4996476 (1991-02-01), Balyasny et al.
patent: 5038248 (1991-08-01), Meyer
patent: 5103976 (1992-04-01), Murphy
patent: 5131535 (1992-07-01), O'Connor et al.
patent: 5177591 (1993-01-01), Emanuel
patent: 5184068 (1993-02-01), Twigg et al.
patent: 5203452 (1993-04-01), Small et al.
patent: 5208529 (1993-05-01), Tsurishima et al.
patent: 5246129 (1993-09-01), Small et al.
patent: 5475259 (1995-12-01), Kasai et al.
patent: 5531329 (1996-07-01), Hayakawa et al.
patent: 5547082 (1996-08-01), Royer et al.
patent: 5561321 (1996-10-01), Hirano et al.
patent: 5596282 (1997-01-01), Giddings et al.
patent: 5597074 (1997-01-01), Ko
"Module Kit Container", IBM Technical Disclosure Bulletin, vol. 28, No. 5, pp. 2175 and 2176, Oct. 1985.
Barnett Gregory A.
Hamren Steven L.
Layer William C.
Nevill Leland R.
Chambliss Alonzo
Chaudhuri Olik
Micro)n Technology, Inc.
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