Trapping storage flash memory cell structure with inversion...

Static information storage and retrieval – Floating gate – Particular connection

Reexamination Certificate

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C365S185150, C365S185290

Reexamination Certificate

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07471564

ABSTRACT:
Methods of manufacturing a nitride trapping EEPROM flash memory are described where each memory cell uses Si-Fin to form a nitride trapping EEPROM flash cell in which the source region and drain region are undoped. Each adjacent poly-gate to a selected poly-gate in a row of nitride trapping memory cells is used to produce the inversion region that acts as a source region or a drain region for transferring of a required voltage, which conserves the density of a memory cell given that the source region and the drain region for each memory cell are not doped. The flash memory includes a plurality of polysilicon layers intersecting with a plurality of Si-Fin layers.

REFERENCES:
patent: 6657252 (2003-12-01), Fried et al.
patent: 6925007 (2005-08-01), Harari et al.
patent: 2007/0076477 (2007-04-01), Hwang et al.
Xuan et al., “FinFET Sonos Flash Memory for Embedded Applications,” IEEE 2003, pp. 26.4-1-26.4.4.
Hsu et al., “Split-Gate NAND Flash Memory at 120nm Technology Node Featuring Fast Programming and Erase,” 2004 Symposium of VLSI Tech, Digest of Tech Papers, pp. 78-79.

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