Transverse hybrid LOC package

Details Transverse hybrid LOC package Transverse hybrid LOC package

1998-08-20

2000-09-26

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438124, 438127, 438121, 438118, H01L 2144, H01L 2148, H01L 2150

Patent

active

061241504

ABSTRACT:
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of inner leads is off-die wire bonded to some of the bond pads, and a second portion of inner leads is insulatively attached as LOC leads between the bond pads along the opposed die edges. The hybrid package results in shorter inner leads of increased pitch enabling improved line yield at wire bond and encapsulation, as well as improved electrical performance, particularly for packages with very small dice.

REFERENCES:
patent: 4033844 (1977-07-01), Pantiga et al.
patent: 4089733 (1978-05-01), Zimmerman
patent: 4279682 (1981-07-01), Hamagami et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4894752 (1990-01-01), Murata et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 4984059 (1991-01-01), Kubota et al.
patent: 4989068 (1991-01-01), Yasuhara et al.
patent: 5126821 (1992-06-01), Okinaga et al.
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5142450 (1992-08-01), Olson et al.
patent: 5184208 (1993-02-01), Sakuta et al.
patent: 5218229 (1993-06-01), Farnworth
patent: 5227661 (1993-07-01), Heinen
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5229639 (1993-07-01), Hansen et al.
patent: 5231755 (1993-08-01), Emanuel
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5234866 (1993-08-01), Okinaga et al.
patent: 5252853 (1993-10-01), Michii
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5331200 (1994-07-01), Teo et al.
patent: 5331201 (1994-07-01), Nishino
patent: 5352633 (1994-10-01), Abbott
patent: 5418189 (1995-05-01), Heinen
patent: 5461255 (1995-10-01), Chan et al.
patent: 5466888 (1995-11-01), Beng et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5475918 (1995-12-01), Kubota et al.
patent: 5521426 (1996-05-01), Russell
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5663594 (1997-09-01), Kimura
patent: 5883427 (1999-03-01), Arimoto
patent: 5907769 (1999-05-01), Corisis
Louis T. Manzione, "Plastic Packaging of Microelectric Devices", pp. 156-347, 1990.
Caroline A. Kevac, "Plastic Package Fabrication", pp. 470-482.

Affiliated with

Also associated with

Rating

Transverse hybrid LOC package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Transverse hybrid LOC package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transverse hybrid LOC package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2099247