Transporting IC-packages

Special receptacle or package – For a vehicle

Patent

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Details

206328, B65D 8538

Patent

active

052635830

ABSTRACT:
A method of transporting PLCC IC packages (3) having J-shaped bend lead pins utilizing containers (1) for transport, in which the IC packages (3) are mounted upside down such that the lead pins cannot be moved to collide against anything within the container during transport. The method thus ensures that the leads of the IC packages are not deformed and loss of the flatness of the leads can be prevented during transport.

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patent: 4266684 (1981-05-01), Maccise
patent: 4564880 (1986-01-01), Christ et al.
patent: 4565288 (1986-01-01), Walther
patent: 4632246 (1986-12-01), Brutosky
patent: 4690274 (1987-09-01), Lue
patent: 4709297 (1987-11-01), Walther
patent: 4712675 (1987-12-01), Scholten et al.
patent: 4721206 (1988-01-01), Votter
patent: 4866574 (1989-09-01), Hsiung

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