Transport system for disc-shaped work-pieces

Details Transport system for disc-shaped work-pieces Transport system for disc-shaped work-pieces

1975-11-19

1978-05-02

Blunk, Evon C.

Cutlery

271195, 302 31, B65G 5102

Patent

active

040871339

ABSTRACT:
A Bernouilli wafer transport system in which semiconductor wafers or similar disc-shaped work-pieces may be transported along rail sections one side of which forms a wafer suspension surface incorporating along its longitudinal symmetry thus the orifices of a number of inclined nozzles connected with a common air or gas duct in the interior of the rail section, said nozzles having an orientation in the desired direction of transportation. A rail section may be constructed in one end to be introduced to a prescribed depth into a wafer supply or receiving magazine and two such rail sections may be combined into a single continuous rail having means for stopping wafer transport in an intermediate position between two magazines. The inclination angle of nozzles relative to a plan to the suspension surfaces may be different for different nozzles along a rail section in order to provide safe control of the unloading and loading of wafers from and into magazines as well as the transportation thereof.

REFERENCES:
patent: 1061526 (1913-05-01), Cortissoz
patent: 3136539 (1964-06-01), Lyman
patent: 3198515 (1965-08-01), Pitney
patent: 3219340 (1965-11-01), Hori et al.
patent: 3503607 (1970-03-01), Gluskin
patent: 3504910 (1970-04-01), Spyropoulos
patent: 3511495 (1970-05-01), Schonfeld
patent: 3614168 (1971-10-01), Range
patent: 3717381 (1973-02-01), Hagler
patent: 3718371 (1973-02-01), Lasch
patent: 3930684 (1976-01-01), Lasch et al.
patent: 3948564 (1976-04-01), Flint
patent: 4002254 (1977-01-01), Olofsen
IBM Technical Disclosure Bulletin, vol. 16, No. 9, Feb. 1974 by Mack et al.

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