Transport method and transport apparatus for semiconductor...

Details Transport method and transport apparatus for semiconductor... Transport method and transport apparatus for semiconductor...

2007-05-08

2007-05-08

Kim, Peter B. (Department: 2851)

Photocopying

Projection printing and copying cameras

With temperature or foreign particle control

C355S075000, C355S072000, C355S077000

Reexamination Certificate

active

10867784

ABSTRACT:
First brush bristles of an alignment stage cleaning mechanism are pressed on a wafer suction stage of the alignment stage before a semiconductor wafer is transported onto the alignment stage, in which state the wafer suction stage rotates to thereby remove dust attached to the wafer suction stage. Moreover, second brush bristles of a wafer chuck table cleaning mechanism are moved on and along a surface facing downward of a wafer chuck table to thereby remove dust attached to the surface facing downward of the wafer chuck table.

REFERENCES:
patent: 4910549 (1990-03-01), Sugita
patent: 5825470 (1998-10-01), Miyai et al.
patent: 6573979 (2003-06-01), Yamada
patent: 6867855 (2005-03-01), Go et al.
patent: 2003/0046786 (2003-03-01), Shirley et al.
patent: 2005/0133061 (2005-06-01), de Larios et al.

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