Transport device for wafers of variable diameter

Material or article handling – Horizontally swinging load support – Swinging about pivot

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Details

2941031, 901 39, 4147446, 414751, 414225, B65G 700

Patent

active

049715127

ABSTRACT:
A transport device for handling wafers of different diameters utilized in the manufacture of semiconductors. A robotic arm is equipped with a fork-shaped wafer support board and an arm slide movable relative to the robotic arm. The fork-shaped end of the support board is provided with fixed pins on one side to support wafers and on another side with plate springs carrying pins which can be depressed by the weight of a wafer to accommodate larger size wafers. The device permits wafers of different diameters accurately and safely to be transferred from its center to a predetermined station without the need for changing the wafer support board or correction of the robotic arm.

REFERENCES:
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patent: 4453757 (1984-06-01), Soraoka
patent: 4639028 (1987-01-01), Olson
patent: 4730976 (1988-03-01), Davis et al.
patent: 4789294 (1988-12-01), Sato et al.
patent: 4808059 (1989-02-01), Eddy
patent: 4813732 (1989-03-01), Klem
patent: 4820930 (1989-04-01), Tsutsui et al.

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