Transparent substrate vertical cavity surface emitting lasers fa

Details Transparent substrate vertical cavity surface emitting lasers fa Transparent substrate vertical cavity surface emitting lasers fa

1995-11-30

1998-03-03

Davie, James W.

Coherent light generators

Particular resonant cavity

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372 36, 372 46, H01S 319

Patent

active

057243760

ABSTRACT:
A method for fabricating transparent substrate vertical cavity surface emitting lasers ("VCSEL"s) using wafer bonding is described. The VCSELs have their active layers located much more closely to a heat sink than is possible in known absorbing substrate VCSELs. The improved heat transport from the active layer to the heat sink permits higher current operation with increased light output as a result of the lower thermal impedance of the system. Alternatively, the same light output can be obtained from the wafer bonded VCSEL at lower drive currents. Additional embodiments use wafer bonding to improve current crowding, current and/or optical confinement in a VCSEL and to integrate additional optoelectronic devices with the VCSEL.

REFERENCES:
patent: 5376580 (1994-12-01), Kish et al.
patent: 5491712 (1996-02-01), Lin et al.
patent: 5502316 (1996-03-01), Kish et al.
patent: 5606572 (1997-02-01), Swirhun et al.

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