Transparent polishing pad

Details Transparent polishing pad Transparent polishing pad

2007-09-25

2007-09-25

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S285000, C451S288000

Reexamination Certificate

active

11494434

ABSTRACT:
The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a separate aperture or window in the polishing pad.

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