Transparent microporous materials for CMP

Details Transparent microporous materials for CMP Transparent microporous materials for CMP

2002-10-28

2008-10-14

Shakeri, Hadi (Department: 3723)

Abrading

Flexible-member tool, per se

C451S041000, C451S285000

Reexamination Certificate

active

07435165

ABSTRACT:
The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 10% or more at at least one wavelength of about 200 nm to about 35,000 nm. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.

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