Abrading – Flexible-member tool – per se
Reexamination Certificate
2002-10-28
2008-10-14
Shakeri, Hadi (Department: 3723)
Abrading
Flexible-member tool, per se
C451S041000, C451S285000
Reexamination Certificate
active
07435165
ABSTRACT:
The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 10% or more at at least one wavelength of about 200 nm to about 35,000 nm. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.
REFERENCES:
patent: 4138228 (1979-02-01), Hartfelt et al.
patent: 4239567 (1980-12-01), Winings
patent: 4954141 (1990-09-01), Takiyama et al.
patent: 5182307 (1993-01-01), Kumar
patent: 5489233 (1996-02-01), Cook et al.
patent: 5605760 (1997-02-01), Roberts
patent: 5628862 (1997-05-01), Yu et al.
patent: 5684055 (1997-11-01), Kumar et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5964643 (1999-10-01), Birang et al.
patent: 6022268 (2000-02-01), Roberts et al.
patent: 6045439 (2000-04-01), Birang et al.
patent: 6062968 (2000-05-01), Sevilla et al.
patent: 6089965 (2000-07-01), Otawa et al.
patent: 6120353 (2000-09-01), Suzuki et al.
patent: 6146242 (2000-11-01), Treur et al.
patent: 6169122 (2001-01-01), Bizard et al.
patent: 6171181 (2001-01-01), Roberts et al.
patent: 6231942 (2001-05-01), Blizard et al.
patent: 6235380 (2001-05-01), Tupil et al.
patent: 6245406 (2001-06-01), Kuramochi et al.
patent: 6248000 (2001-06-01), Aiyer
patent: 6261155 (2001-07-01), Jairath et al.
patent: 6284810 (2001-09-01), Burnham et al.
patent: 6328644 (2001-12-01), Kuramochi et al.
patent: 6358130 (2002-03-01), Freeman et al.
patent: 6368200 (2002-04-01), Merchant et al.
patent: 6425816 (2002-07-01), Roberts et al.
patent: 6428586 (2002-08-01), Yancey
patent: 6435947 (2002-08-01), Mueller et al.
patent: 6454634 (2002-09-01), James et al.
patent: 6537134 (2003-03-01), Newell
patent: 6641471 (2003-11-01), Pinheiro et al.
patent: 2001/0053658 (2001-12-01), Budinger et al.
patent: 2002/0010232 (2002-01-01), Ogawa et al.
patent: 2002/0016146 (2002-02-01), Kuramochi et al.
patent: 2002/0072296 (2002-06-01), Muilenburg et al.
patent: 2002/0098790 (2002-07-01), Burke
patent: 2002/0123300 (2002-09-01), Jones et al.
patent: 1 046 466 (2000-10-01), None
patent: 1 108 500 (2001-06-01), None
patent: 1211024 (2002-06-01), None
patent: WO 98/28108 (1998-07-01), None
patent: WO 00/59702 (2000-10-01), None
patent: WO 01/15863 (2001-03-01), None
patent: WO 01/15885 (2001-03-01), None
patent: WO 01/36521 (2001-05-01), None
patent: WO 01/68322 (2001-09-01), None
patent: WO 01/94074 (2001-12-01), None
patent: WO 02/02274 (2002-01-01), None
patent: WO 02/09907 (2002-02-01), None
Borg-Breen Caryn
Cabot Microelectronics Corporation
Koszyk Francis J.
Omholt Thomas E.
Shakeri Hadi
LandOfFree
Transparent microporous materials for CMP does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Transparent microporous materials for CMP, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transparent microporous materials for CMP will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3992465