Transmission lines for wafer-scale integration and method for in

Wave transmission lines and networks – Long lines – Strip type

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333246, H01P 308

Patent

active

052026574

ABSTRACT:
A method and apparatus for optimizing the signal transmission speed between a signal source and a signal receiver of a microelectronic circuit is disclosed. The method includes the step of providing a signal transmission path whose length provides a predetermined ratio between its resistance and characteristic impedance which will reproduce the transmitted signal at the receiving end upon the first signal transition. The length of this transmission path may be increased by using a nonhomogeneous line structure in which the characteristic impedance increases in the direction of the signal transmission. In one form of the invention, the signal transmission path is formed by interconnecting a plurality of micro-strip conductors disposed on different planes of a universally programmable silicon circuit board. Under the appropriate circumstances, a signal can travel through such a "semi-lossy" transmission path at approximately the speed of light.

REFERENCES:
patent: 3634789 (1972-01-01), Stuckert
patent: 4458297 (1984-07-01), Stopper et al.
patent: 5097232 (1992-03-01), Stopper

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