Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-11-13
2007-11-13
Hammond, Briggitte R. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
11463283
ABSTRACT:
A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.
REFERENCES:
patent: 3842189 (1974-10-01), Southgate
patent: 3952404 (1976-04-01), Matunami
patent: 4189342 (1980-02-01), Kock
patent: 5280139 (1994-01-01), Suppelsa et al.
patent: 5506515 (1996-04-01), Godshalk et al.
patent: 5613861 (1997-03-01), Smith et al.
patent: 5665648 (1997-09-01), Little
patent: 5848685 (1998-12-01), Smith et al.
patent: 5914218 (1999-06-01), Smith et al.
patent: 5944537 (1999-08-01), Smith et al.
patent: 5979892 (1999-11-01), Smith
patent: 6046599 (2000-04-01), Long et al.
patent: 6091256 (2000-07-01), Long et al.
patent: 6184065 (2001-02-01), Smith et al.
patent: 6184699 (2001-02-01), Smith et al.
patent: 6194739 (2001-02-01), Ivanov et al.
patent: 6208225 (2001-03-01), Miller
patent: 6213789 (2001-04-01), Chua et al.
patent: 6218910 (2001-04-01), Miller
patent: 6252175 (2001-06-01), Khandros
patent: 6290510 (2001-09-01), Fork et al.
patent: 6528350 (2003-03-01), Fork
patent: 6534249 (2003-03-01), Fork et al.
patent: 6768403 (2004-07-01), Hsu et al.
patent: 6827584 (2004-12-01), Mathieu et al.
patent: 2002/0013070 (2002-01-01), Fork et al.
patent: 2002/0110757 (2002-08-01), Fork et al.
patent: 2002/0110761 (2002-08-01), Fork et al.
patent: 2002/0164893 (2002-11-01), Mathieu et al.
patent: 2003/0010615 (2003-01-01), Fork et al.
patent: 2004/0102064 (2004-05-01), Mathieu
Microstrip Trace Impedance Calculator: http://www.ernclab.umr.edu/pcbtlc/microstrip.html.
Impedance Calculator for Grounded Coplanar 3-Strip Structure: http://www.eecircle.com/applets/016/Gcp3.html.
Chua Christopher L.
Fork David K.
Van Schuylenbergh Koenraad F.
Bever Patrick T.
Bever Hoffman & Harms LLP
Hammond Briggitte R.
Palo Alto Research Center Incorporated
LandOfFree
Transmission-line spring structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Transmission-line spring structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transmission-line spring structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3890998